•  Full coverage of Multiple Process Routes include GaN  SiC GaAs CMOS SOI

•  Full Device Series of PA LNA ATT PS

•  Electrical performance design technology

•  Structural design technology

•  Process manufacturing technology

•  System array "six natures" design technology

•  Antenna array pattern synthesis technology

•  Structural mechanics design of array system

•  Thermal control design of antenna array system

•  Broadband wide-angle antenna element design

•  Microwave T/R Component R&D and Manufacturing Technology

Antenna

Integrated

Integrated

Technology

Structura

mechanics

•  3D Interconnect Technology

•  High Integration/Small  Size/Flexible Usage/Strong Reconfigurability

•  X/KU/KA band

•  Industry-first heterogeneous integrated chip technology

•  Combining GaN / GaAs / CMOS processes to achieve the best combination of power consumption, integration, and cost

•  Introduction of mass production architecture for 5G communication and satellite communication base station arrays

•  High performance, low cost, large-scale production capabilities

•  Thermal Design

•  Structural mechanics design

•  Multi-functional

•  High Power

•  High Efficiency

•  Low NF

•  Large Dynamic Range

•  Dual-Polarization

•  High Isolation

•  Ultra-Wideband

•  MCM Automated Micro-Assembly

•  TR Module Triple Protection

•  Hermetic Sealing